Brief

In 1997, Schlumberger started incubating the electron beam wafer inspection project.*1. I was the first engineer to work with the strategic marketing VP to articulate the proof of concept system and the alpha system that included new column design, 2 new control boards, an array of image processors, and algorithm and driving software for the proof of concept system. Learning from Alcedo’s experience, I articulated a much easier but still effective control card for electron imaging.
By 2001, I had successfully established and grown the engineering physics team from within this group that included  PhDs, 1 MSEE, and 1 technician. The group became a world-class team in the electron optics/microscopy industry.
*1The wafer inspection tool functioned like a high speed 'electron microscopy camera' for taking 30-100 pictures per second continuously to find electrical and nano-scale defects in semiconductor wafers. The product comprises 20-40 Power PC processors working in parallel to process incoming image streams.
I advised the GM and the strategic marketing VP on system architecture, roadmapping and competitive technology analysis (multi-beam, projection microscopy, micro-column, etc.).
In 1995 Schlumberger Semiconductor Solution had more than 90% of the electron prober*2 market. Initially, I was hired as a design engineer to work on the electron optics and the product application.

*2The electron beam wafer prober functioned like an oscilloscope with a sub-micron scale 'electron' probe to read the signals of sub-micron scale circuits.
Project/
management

Established and managed an engineering physics team from the ground up that included 4 PhDs, 1 MSEE, and 1 technician. This group became a world-class team in the electron optics community.

Advised the GM and the strategic marketing VP on system architecture, roadmapping and competitive technology analysis (multi-beam, projection microscopy, micro-column, etc.).

Led a team of scientists, engineers and technicians (~6 people) to develop an advanced electron microscopy inspection system for semiconductor wafer inspection. The scope included electron optics and engineering, electron detection, electron material interactions/charging, electron beam control and image acquisition and processing.

Formed a strong partnership with Delong Instruments in the Czech Republic to cut manufacturing costs by 5x, and to shorten delivery time by 5x. I learned from early mistakes and installed a procedure to fix initial quality issues.

Built an engineering physics team from the ground up.  This group became a world-class team in the electron microscopy wafer inspection community.

Worked with manufacturing engineers to bring prototypes to products.

Worked with marketing managers to lay out a product-development roadmap.

Managed technology transfer to the manufacturing group to build alpha and beta systems and improvements.

Managed programs for 2 summer students from UC-Berkeley.

Managed the development of positive ion cleaning technology with FMT Technology and the University of Maryland.

Technology/
Innovation

Developed a wide angle object lens approach to differentiate from the market leader, KLA-Tenor.

Developed a PIN diode detector for meeting wide angle, high speed and high quantum efficiency electron detection requirements.

Formed a partnership with Delong Instruments to develop a next generation, single beam electron column comprising a magnetic election gun with no beam cross-over to reduce coulomb interactions.

Discovered the principles of device charging on electron beam image formation.

Successfully developed solutions for the electron beam prober to probe sub-micron devices covered by insulators.

System/
electronics

Through my experience at Alcedo, Inc., I learned the major shortcomings/challenges of using micro-processors for controlling pattern generation and therefore, championed the "next generation" digital scan generator using only counter and state machines without involving complex microprocessor control; my proposal was initially opposed by several senior members who favored the micro-processor scheme, but subsequently adopted and implemented into the product.

Led a team consisting of a software engineer, an electrical engineer, and a Berkeley summer intern to debug the digital scan generator for logical bugs, hung state in the state machines. I successfully debugged the prototype board.

Served as one of the key members in the noise reduction team hunting for mechanical vibration, ground loop electronic noise, electronic noise source and reduction.

Served as one of the key members in the analog electronic board architecture design and prototype debugging team for controlling the electron optics (containing electrostatic and magnetic coils drivers).

Served as one of the key members in the development of a high speed PIN diode detector (floating at high voltage) system.

One of the key members in removing 'micro-discharge' noise injected into the sensitive detector pre-amplifier due to high voltages.

Led a team that successfully debugged and implemented the complete prototype electronic cards in the lab, fixed bugs, then transferred the know-how to production.

Reverse engineered the legacy digital scan pattern generator and image formation board by tracing electronic schematic diagrams and PAL codes.

Designed experiments which ultimately discovered the root cause that killed detector electronics that floated at several kilo volts.
Software

Led a team for C++ programming for driving what was then a new electron beam scan generator (on VME bus) and image formation prototype. The basic code platform was later adopted by the software group to use in the product.

Led a team for controlling an x-y stage carrying the electron optic aperture.

One of the inventors of an image processing patent.

Wrote image processing algorithms (using Matrix library) during the proof of concept phase.

Wrote code in C++ to control an electron energy analyzer and the electron beam.

Mechanics

Managed a team comprising engineers from the US, the Czech Republic and Japan for mechanical component/sub systems design, specification, manufacture and testing.

Led the design, development and manufacture of a new objective lens and detectors.

Led the design, development and manufacture of a new magnetic electron gun (source and lenses).

Led the design and development of a vacuum stage with vendor Anorad.

Invented a vacuum wafer stage that reduced the foot print by 1.5-2x, and reduced noise. This design was adopted by the vendor for other customers.

Led the R&D and production of a precision ceramic lens component.

Developed an electron energy analyzer capable of working under a strong magnetic field.

Out sourcing/
Partnership

Pioneered the outsourcing of mechanical design and manufacturing of objective lenses to cut costs by 5 times and shorten delivery time by 5 times.

Collaborated with our technology partner in the Czech Republic and Japan for design and manufacturing of various optical components used in the electron microscopy column.

Implemented a quality control scheme to increase the Czech's manufacturing quality.
Early stage venture

One of the key architects in the birth of Schlumberger’s electron wafer inspection system.

The first engineer to join the project, which eventually grew to the size of more than 100 people.

Learned team building and valuable lessons from the growing pains associated with this project.

Patents

I was, at the time, the youngest member in the patent hall of fame for Schlumberger Semiconductor Solutions.

US patent # 6,344,750, US patent # 6,232,787, US patent # 6,252,705, US patent # 6,252,412,
US patent # 6,091,249, US patent # 5,920,073